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â—Product Introduction:
With the rapid development of the electronics industry, the requirements for high Tg FR4 PCBs are becoming higher due to their high heat resistance. Under high temperature, especially after heating and absorbing moisture, the mechanical strength, dimensional stability, adhesion, water absorption, thermal decomposition, and thermal expansion of high Tg FR4 PCBs are significantly better than those of ordinary FR4 PCBs.
â— Product Features:
1) It has good heat resistance and does not deform at high temperatures.
2) It is more affordable than metal core PCB and has high cost performance.
3) It has good heat dissipation performance, dissipates heat quickly, and will not short circuit due to overheating.
â—Product Application:
High Tg FR4 PCBs have been used in gateways, RFID, inverters, antenna boards, wireless boosters, contract manufacturing services, low cost PLCs, embedded system development, embedded computer systems, AC power supplies...
â—Product Specification：
Material: |
FR-4 |
Solder Mask: |
Green |
FR4-TG: |
TG 170℃ |
Min Trace Width/Spacing: |
6/6mil↑ |
Layers: |
2-layer |
Min Hole Size: |
0.3mm↑ |
Size: |
57 x 59 mm |
Minimum Solder Mask Dam: |
0.4mm↑ |
Different Design In Panel: |
1 |
Half Hole: |
No |
Quality Level |
IPCII |
Surface Finish: |
ENIG |
Board Thickness: |
1.6mm |
Finished Copper: |
1oz |
Silkscreen: |
White |
Test Type: |
Fully test |
â—Product Details:
â—Deliver
5-8 working days include shipping time.
â—Safeguards Ordinance
https://www.szospcb.com/